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Motherboard Disassemble Platform Heating Groove For Mobile Phone - T12A - F

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Motherboard Disassemble Platform Heating Groove For Mobile Phone - T12A - F



The motherboard disassemble platform heating groove for mobile phone - T12A - F including heating area, Fingerprint repair

heating slot, IC slot, Universal heating slot, Silicone insulation, High purity copper film, Screen bracket in addition to glue. It is used to bracket

heating degumming, IC heating degumming, Universal heating and removing glue, Fingerprint repair, and glue removal. It is matched with

the Motherboard Disassemble Platform Main Unit - SS-T12A.



This item is just including the mobile phone - T12A - F motherboard heating groove, not including the heating station's main unit.



● Model: T12A - F

● motherboard heating groove size: 126*72*18 mm (L*W*H)

● Net weight: 363 g

● Temperature: 100-280℃



For Mobile Phone



● Accurate temperature control and temperature adjustable.

● Offers heat evenly to protect the motherboard from damage.

● High purity copper is used as a film to ensure uniform heat transfer and heat.

Please be aware that due to your computer monitor display the color may have some difference between the picture and the physical item

Please according to you to buy the dress fabric, select the corresponding fabric color chart

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